Active Cooling Modules (ACM) | Apply Online

Opportunity Summary:

DARPA's Active Cooling Modules (ACM) opportunity (Funding Opportunity Number: DARPA BAA 09-44) is a research solicitation from the Microsystems Technology Office focused on next-generation thermal management for demanding Department of Defense systems. The basic problem DARPA is targeting is a common tradeoff in modern electronics and defense platforms: as systems are pushed to deliver higher performance while also shrinking in size and weight, their power density often rises, which makes it harder to remove heat. In many real-world DoD use cases, heat rejection becomes the bottleneck that limits achievable performance, reliability, or packaging, even when other technologies improve.

The central objective of the ACM program is to develop and demonstrate active cooling approaches that rely on novel materials and device structures rather than conventional heat sinks or incremental improvements to existing cooling hardware. DARPA is specifically looking for solutions that can deliver "tens of degrees" of temperature reduction while cooling 100-watt-class devices, packaged into centimeter-scale cooling modules. Alongside that cooling lift and compact size, DARPA sets a strong efficiency target: a coefficient of performance (COP) of 3 or better, meaning the cooling solution should ideally provide at least three units of heat removal for every unit of input power. In practice, that requirement signals that DARPA is not only interested in achieving cooling at small scales, but doing so efficiently enough that the cooling system does not negate overall platform power and thermal budgets.

From an applicant standpoint, the announcement is categorized as a discretionary funding opportunity and allows multiple award instruments, including cooperative agreements, grants, other procurement contracts, and similar mechanisms. Eligibility is listed as unrestricted, meaning proposals may be submitted by a wide range of entity types, subject to any limits or clarifications contained in the full BAA text. The program is aligned to CFDA 12.910 (Research and Technology Development), and the notice indicates there is no cost sharing or matching requirement. The public listing does not specify an award floor or ceiling (both shown as 0), which usually implies that funding amounts and project scope are governed by the BAA details and the content of proposed efforts rather than a simple fixed cap in the synopsis.

Key dates in the posting show it was posted on April 23, 2009, with an abstract due date of June 18, 2009 at 12:00 PM Eastern Time and a first-round proposal due date of August 13, 2009 at 12:00 PM Eastern Time. The original closing date and current closing date are both listed as April 22, 2010, with an archive date of May 14, 2010, which indicates the BAA remained open for submissions or amendments through that window, consistent with the way BAAs can operate over longer periods.

For communications and submission-related questions, DARPA emphasizes electronic correspondence. Administrative correspondence (including questions about how to submit proposal abstracts or full proposals and system questions related to TFIMS) is directed to DARPA-BAA-09-44@darpa.mil, with an administrative/TFIMS phone line at (703) 351-8427. Technical questions are supported via (703) 351-8573. The program is managed within DARPA/MTO, and the notice lists Dr. Thomas Kenny as the Program Manager, with a mailing address at 3701 North Fairfax Drive, Arlington, VA 22203-1714, and a BAA Coordinator reference. The synopsis also points applicants to the MTO Solicitations Page and notes that the full BAA document contains the complete requirements, submission instructions, and evaluation details.

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