Defense Production Act (DPA) Title III 3D Microelectronics for Information Protection Program | Apply Online

Opportunity Summary:

The Defense Production Act (DPA) Title III 3D Microelectronics for Information Protection Program (Funding Opportunity Number: FOA AFRL RQKM 2016 0017) is a Department of Defense initiative run through the Air Force Research Laboratory (DOD-AFRL) that aims to strengthen U.S. domestic manufacturing capacity for advanced microelectronics. The central goal is to expand an existing U.S.-based supplier's ability to produce three-dimensional (3D), ultra-high density microelectronics modules that can be used to help protect Critical Program Information (CPI). In practical terms, the program is trying to ensure there is a reliable, economically sustainable domestic source for highly advanced 3D microelectronics hardware designed for information protection use cases tied to national defense needs.

The work is framed as a DPA Title III effort, meaning it is oriented toward industrial base expansion and production capability, not just early-stage research. The emphasis is on scaling and maturing manufacturing so the supplier can produce these modules consistently and at viable yields. A major focus area is product yield improvement, which typically refers to increasing the percentage of manufactured units that meet specifications without defects, rework, or scrap. Improving yield is crucial for high-density 3D microelectronics because these devices can be complex to fabricate, and low yields can make production too expensive or too slow for defense supply chain needs.

Alongside yield improvement, the opportunity calls for expansion of production facilities. The intent is to move beyond limited or boutique capability and build out a production environment that can support regular DoD demand. The program explicitly ties this facility and process expansion to creating an economically viable supplier, signaling that the government is looking for outcomes that can persist after the period of performance, rather than a one-off demonstration line that cannot compete or sustain operations.

Another core element is verification of quality against current industry standards, with quality verification including both production and testing of the resulting 3D ultra-high density microelectronics modules. This indicates the program expects measurable, test-backed proof that the modules meet recognized benchmarks for reliability and performance, not simply that manufacturing capacity exists. The testing and verification portion also reinforces that the effort is meant to produce real hardware and validate it in a way that would be meaningful for eventual defense acquisition and deployment, especially for CPI protection applications where trust, consistency, and security-related assurance are critical.

From an administrative standpoint, this is a discretionary funding opportunity using a cooperative agreement, which generally implies substantial government involvement during execution compared to a more hands-off grant. The activity category is listed under Science and Technology and other Research and Development, but the description makes clear that the thrust is production capability expansion and manufacturability improvement rather than purely exploratory R&D. The CFDA number is 12.800, and eligibility is described as unrestricted (open to any type of entity), subject to any additional clarifications that may appear in the full announcement.

Key dates and award structure reflect a targeted, single-award effort. The opportunity was posted and created on June 15, 2016, with an application closing date of August 1, 2016 (original and current closing dates match). The expected number of awards is one, indicating the government likely intended to select a single supplier or team to carry out the capability expansion and yield improvement work. The award ceiling is not specified in the provided data, which typically means funding level details would need to be taken from the full solicitation or related program documents.

Overall, the opportunity can be summarized as a DoD industrial base investment to grow and stabilize domestic production of 3D ultra-high density microelectronics modules that incorporate information protection features, with concrete deliverables tied to improved manufacturing yields, expanded production facilities, and validated quality through industry-standard testing and verification.

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