Defense Production Act (DPA) Title III Technology Market Research for 3D Microelectronics for Information Protection Project | Apply Online

Frequently Asked Questions (FAQ)

What is this opportunity?

This is a Defense Production Act (DPA) Title III market research request issued by the Air Force Research Laboratory (DOD-AFRL). It is a Request for Information (RFI) focused on a potential future investment area called "3D High Density Microelectronics for Information Protection."

Is this a grant solicitation or a Request for Information (RFI)?

It is an RFI. The government is seeking input from industry (technical, manufacturing, and market information) rather than immediately awarding a full production or R&D contract.

What is the government trying to accomplish with this RFI?

The goal is to understand who can support a domestic, scalable capability to produce advanced 3D, ultra-high density microelectronics modules that help protect sensitive defense-related information, and to gather information that can shape potential future investments and acquisition strategy.

What technology area is AFRL interested in?

The target technology is three-dimensional, ultra-high density microelectronics modules intended for Critical Program Information (CPI) protection applications. This points to advanced 3D packaging and integration approaches such as stacked die, high-density interconnects, and module-level integration, with information protection features built into the module.

What does "information protection" mean in the context of this RFI?

Based on the notice, the emphasis is on microelectronics modules designed for CPI protection, with protection features integrated into the module itself. The notice does not provide specific mechanisms, but it frames the need as protecting sensitive defense-related information through the module design and integration approach.

Is the government looking for a one-time demonstration or something manufacturable?

The emphasis is not limited to a one-off technical demonstration. The RFI stresses manufacturability and dependability at scale, with relevance to both Department of Defense needs and commercial markets.

What are the main focus areas highlighted in the RFI?

The RFI highlights two central areas: (1) product yield improvement for these types of 3D modules, and (2) expansion of production facilities to support an economically viable domestic supplier base serving both DoD and commercial demand.

Why is product yield improvement specifically emphasized?

The notice indicates that current processes may be constrained by defect rates, process variability, or assembly and test challenges that reduce the number of acceptable units produced. AFRL is seeking insights into raising yield to improve throughput and reduce cost per usable unit.

What kinds of yield-improvement approaches does the RFI suggest industry might discuss?

The notice points to areas such as process control, design-for-manufacturability changes, improved inspection and test methods, better materials or bonding approaches, and other manufacturing innovations that increase usable output and lower per-unit cost.

What does the RFI say about scaling and facility expansion?

The RFI is interested in readiness and scalability of production approaches and what facility upgrades or capacity expansions would be required. It also calls out potential bottlenecks such as equipment, tooling, workforce, qualified materials, and specialty processes.

How does DPA Title III relate to this effort?

DPA Title III efforts commonly focus on strengthening or expanding domestic industrial capacity and reducing supply chain risk for strategically important technologies. This RFI aligns with that by exploring how to create a sustainable, scalable domestic capability for advanced 3D microelectronics modules.

Does this notice indicate the government plans to make an award?

The listing indicates an expectation of one award, but the notice is an RFI. The key point is that AFRL and the DPA Title III program are collecting information now to shape possible future investments, requirements, and acquisition strategy, rather than committing to an immediate program award.

What is the funding instrument type associated with this opportunity?

The opportunity is associated with a cooperative agreement as the funding instrument type.

What does a cooperative agreement imply (if it becomes a funded program later)?

A cooperative agreement typically implies substantial government involvement in technical direction. The notice indicates this instrument type for the opportunity, suggesting the government may expect an active role if the effort proceeds into a funded program.

What is the activity category for this opportunity?

It falls under the Science and Technology and other Research and Development activity category.

What CFDA number is associated with this opportunity?

The notice is associated with CFDA 12.800.

Who is eligible to respond?

Eligibility is described as unrestricted, meaning any type of entity may respond, subject to any additional constraints that may appear in the full text of the notice.

What is the estimated funding amount shown, and what does it mean?

The notice references an estimated funding figure of $100,000, but it explicitly states this amount is only an estimate for the market research effort and does not represent the funding level for any later program. It should be treated as informational, not as a cap or a promise of future award size.

What are the key dates for this opportunity?

The posting was created and posted on January 6, 2016, and it had a closing date of February 5, 2016.

What kinds of information is AFRL seeking from industry through this RFI?

AFRL is seeking technical, manufacturing, and market information, including insights on improving yield, making the technology manufacturable at scale, understanding production readiness, identifying bottlenecks, and describing facility upgrades or expansions needed to support an economically viable domestic supplier base that can serve both DoD and commercial markets.

Why does the notice mention both DoD and commercial markets?

The notice frames the goal as creating a sustainable business case supported by a mix of defense and commercial sales, consistent with building an economically viable supplier base and scalable domestic production capability.

What is the intended end state if this investment area moves forward?

Based on the notice, the intended end state is a domestic, scalable, economically viable capability to produce advanced 3D, ultra-high density microelectronics modules with built-in information protection features, improved yields, and production capacity relevant to both defense and commercial demand.