Defense Production Act Title III Advanced Complementary Metal Oxide Semiconductor (CMOS) Focal Plan Arrays (FPA) for Visible Sensors for Star Trackers (VSST) Project | Apply Online

Opportunity Summary:

The Defense Production Act (DPA) Title III Advanced CMOS Focal Plane Arrays (FPA) for Visible Sensors for Star Trackers (VSST) Project is a U.S. Air Force Research Laboratory funding opportunity aimed at strengthening the domestic industrial base for space-qualified visible imaging sensors. The core purpose is to increase the availability of U.S.-made visible imagers built with advanced Complementary Metal Oxide Semiconductor (CMOS) technology, specifically those suitable for flexible visible imaging systems used on satellites supporting Department of Defense missions and other U.S. Government requirements. In practical terms, the government is looking to ensure that critical sensor components used in spacecraft attitude determination and navigation functions (such as star tracking) can be produced reliably within the United States, at sufficient volume, quality, and consistency to support current and future programs.

A key example of the type of deliverable targeted by the solicitation is a visible Sensor Chip Assembly (SCA) that meets the STELLAR specification (Staring Technology for Enhanced Linear Line of site Angular Recognition), referenced in Appendix V of the Broad Agency Announcement. Star tracker sensors are used to image star fields and compute spacecraft orientation with very high precision, so the solicitation emphasizes devices that are not just technically capable, but also manufacturable at scale with dependable quality. By focusing on advanced CMOS FPAs for visible wavelengths, the program is implicitly pushing toward modern solid-state imaging approaches that can offer benefits such as lower power, improved integration, and potentially better manufacturability compared to older detector technologies, while still meeting the demanding requirements of space operation.

The work scope highlights manufacturing and production readiness improvements more than early-stage lab research. Proposed technical activities may include expanding production capacity, improving production yield, and improving overall quality, which points to the government’s interest in reducing bottlenecks, lowering scrap rates, tightening process control, and increasing throughput for these specialized sensors. The solicitation also indicates that sensor assembly and qualification tasks are in scope, meaning offerors can propose work that goes beyond wafer fabrication or die-level performance and into packaging, integration, and the environmental testing needed to prove the assemblies are suitable for space (for example, demonstrating performance after conditions such as vibration, thermal cycling, and radiation-related considerations typically associated with satellite hardware qualification).

An important structural requirement is that technical activities must be backed by business development tasks as described in the BAA. This signals that the government is not only paying for process improvements, but also expects a commercialization and sustainment plan that results in a lasting supplier capability. The ideal performer is described as a manufacturer with a merchant supplier orientation: a company willing and able to sell the resulting devices broadly to any customer, rather than producing only for a single prime contractor or a narrow internal program. That “open merchant” emphasis is consistent with DPA Title III goals, which commonly focus on creating resilient domestic supply chains by ensuring multiple programs can access critical components from a stable, scalable, U.S.-based source.

From an administrative standpoint, this was posted as a discretionary opportunity under Funding Opportunity Number BAA 11 15 PKM, with the Air Force Research Laboratory as the sponsoring agency. The opportunity allowed multiple award instruments (cooperative agreement, grant, or procurement contract), but anticipated a single award, indicating a concentrated investment in one industrial performer or team. The estimated total funding was approximately $25.08 million, and cost sharing or matching was required, which typically means the awardee would need to contribute a portion of the project cost through cash or allowable in-kind contributions. Eligibility was listed as unrestricted (open to any entity type, subject to any additional clarifications in the full text), aligning with the goal of attracting capable domestic manufacturers and integrators from across industry.

Key timing details included an original closing date of July 26, 2011, later extended to August 31, 2011, with an archive date of September 30, 2011. The CFDA listing associated with the program was 12.800, the Air Force Defense Research Sciences Program. A point of contact was provided for access and assistance, indicating the opportunity was managed through standard AFRL agreements and contracting channels.

Overall, the VSST project is best understood as an industrial base and production-enablement effort focused on advanced CMOS visible focal plane arrays and their assemblies for star tracker applications. The government’s intent is to move beyond one-off or fragile sourcing by funding tangible improvements in domestic manufacturing capability, yield, quality, assembly, and qualification, while requiring a credible business approach that keeps the resulting products available to the broader market of government and commercial customers who need space-relevant visible imaging sensors.

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