Opportunity Information: Apply for DARPA BAA 12 16
Apply for DARPA BAA 12 16
- The DARPA Microsystems Technology Office in the science and technology and other research and development sector is offering a public funding opportunity titled "Diverse Accessible Heterogeneous Integration (DAHI) Foundry Technology" and is now available to receive applicants.
- Interested and eligible applicants and submit their applications by referencing the CFDA number(s): 12.910 Research and Technology Development.
- This funding opportunity was created on Jun 14, 2012 and posted on Mar 29, 2012.
- Applicants must submit their applications by Jul 23, 2012. (Agency may still review applications by suitable applicants for the remaining/unused allocated funding in 2026.)
- Eligible applicants include: Unrestricted (i.e., open to any type of entity above), subject to any clarification in text field entitled Additional Information on Eligibility.
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Opportunity Summary:
The Diverse Accessible Heterogeneous Integration (DAHI) Foundry Technology opportunity is a DARPA Microsystems Technology Office (MTO) Broad Agency Announcement (BAA), identified as DARPA BAA 12-16. It focuses on research and development aimed at pushing forward heterogeneous integration, meaning the ability to combine different semiconductor materials and device technologies together in a tightly integrated way on a common silicon substrate. The central idea is to move beyond traditional, single-material silicon-only approaches by enabling manufacturable processes that can integrate a wider range of high-performance or specialized materials and devices directly with silicon, supporting more capable circuits and microsystems.
A key emphasis of the DAHI program is not only demonstrating integration in a lab setting, but establishing a practical, manufacturable "foundry technology" that can be made accessible to a broad design community. In other words, the effort is intended to result in processes and capabilities that designers can reliably use to build innovative circuits or microsystems, rather than one-off demonstrations. The opportunity is framed around developing advanced heterogeneous integration processes that allow diverse material systems (for example, materials chosen for RF, photonics, power, sensing, or other specialized functions) and device technologies to be integrated closely on silicon so that designers can mix and match capabilities that are difficult or impossible to achieve with standard silicon processes alone.
From an administrative standpoint, the posting reflects multiple amendments. Amendment 01 added information about a Proposers Day, including the date and a registration website, which is typically used by DARPA to brief interested teams, explain goals and constraints, and encourage teaming and questions before proposals are submitted. Amendment 02 then updated the proposal due date, with the revised deadline highlighted in the conformed BAA document. The original closing date was July 9, 2012, and the amended, current closing date became July 23, 2012. The opportunity was posted March 29, 2012, created in the system June 14, 2012, and later archived January 23, 2013.
In terms of award mechanics, the opportunity is listed as discretionary funding and allows multiple instrument types, including cooperative agreements, grants, other transactions or similar arrangements, and procurement contracts. It sits under the Science and Technology and other Research and Development activity category, with CFDA number 12.910 (Research and Technology Development). No cost sharing or matching requirement is indicated. The award floor and ceiling are both listed as 0 in the summary data, which commonly means the actual funding amounts were not specified in that particular summary record and would instead be described in the full BAA attachment or handled through DARPA’s proposal and negotiation process.
Eligibility is described as unrestricted, meaning it is broadly open to any type of entity, subject to any clarifications in the full announcement. This generally signals that universities, small businesses, large businesses, nonprofit organizations, and other qualified performers may be able to propose, depending on the specific BAA terms and any export control, security, or other compliance requirements stated in the full document.
For additional details, DARPA directed applicants to the MTO Solicitations page and the full DARPA BAA 12-16 attachment. The listed point of contact for access issues and coordination is Dr. Sanjay Raman, Program Manager at DARPA MTO and BAA Coordinator.
Frequently Asked Questions (FAQs): DARPA DAHI Foundry Technology (BAA 12-16)
What is the DAHI Foundry Technology opportunity?
The Diverse Accessible Heterogeneous Integration (DAHI) Foundry Technology opportunity is a DARPA Microsystems Technology Office (MTO) Broad Agency Announcement (BAA), identified as DARPA BAA 12-16. It supports research and development focused on heterogeneous integration for advanced microsystems.
What does "heterogeneous integration" mean in this program?
In this context, heterogeneous integration means combining different semiconductor materials and device technologies together in a tightly integrated way on a common silicon substrate. The goal is to move beyond traditional silicon-only approaches by enabling processes that integrate a wider range of high-performance or specialized materials and devices directly with silicon.
What is the main technical goal of DAHI?
The main goal is to push forward heterogeneous integration by developing manufacturable processes that allow diverse material systems and device technologies to be closely integrated on silicon. This is intended to support more capable circuits and microsystems than would be possible using standard silicon processes alone.
Is the program focused on one-off lab demonstrations or manufacturable capability?
A stated emphasis of the program is to go beyond demonstrating integration in a lab setting and instead establish practical, manufacturable "foundry technology." The intent is for the resulting processes and capabilities to be reliable and usable by a broad design community, rather than being one-off demonstrations.
What does DARPA mean by "foundry technology" in this opportunity?
Based on the description provided, "foundry technology" refers to manufacturable processes and capabilities that can be made accessible to designers so they can reliably build innovative circuits or microsystems using heterogeneous integration on silicon.
What kinds of functions or material systems are implied as targets for integration?
The description notes that diverse material systems may be chosen for functions such as RF, photonics, power, sensing, or other specialized functions. The focus is on enabling designers to mix and match capabilities that are difficult or impossible to achieve with standard silicon processes alone.
Who is sponsoring and managing this opportunity?
The opportunity is associated with DARPA’s Microsystems Technology Office (MTO). A listed point of contact is Dr. Sanjay Raman, Program Manager at DARPA MTO and BAA Coordinator.
What is the solicitation number or identifier?
The announcement is identified as DARPA BAA 12-16.
What type of funding opportunity is this?
It is listed as discretionary funding under a Broad Agency Announcement (BAA) structure, which is typically used for research and development efforts.
What award instruments are allowed under this opportunity?
The opportunity allows multiple instrument types, including cooperative agreements, grants, other transactions or similar arrangements, and procurement contracts.
What is the activity category for this opportunity?
The opportunity is categorized under Science and Technology and other Research and Development.
What is the CFDA number associated with this opportunity?
The CFDA number listed is 12.910 (Research and Technology Development).
Is cost sharing or matching required?
No cost sharing or matching requirement is indicated in the summary information provided.
What are the award floor and award ceiling amounts?
The award floor and ceiling are both listed as 0 in the summary data. This commonly indicates that specific funding amounts were not provided in that summary record and may instead be detailed in the full BAA attachment or addressed through DARPA’s proposal and negotiation process.
Who is eligible to apply?
Eligibility is described as unrestricted, meaning it is broadly open to any type of entity, subject to any additional clarifications or requirements in the full announcement.
Does "unrestricted eligibility" mean any organization can apply without conditions?
The summary describes eligibility as unrestricted, but it also notes that eligibility may still be subject to terms in the full BAA. The full announcement may include clarifications and requirements that could affect who can participate.
Were there any amendments to this BAA?
Yes. The posting reflects multiple amendments. Amendment 01 added information about a Proposers Day (including the date and a registration website). Amendment 02 updated the proposal due date, with the revised deadline highlighted in the conformed BAA document.
What is a DARPA Proposers Day and how does it relate to this opportunity?
Amendment 01 added Proposers Day information. A Proposers Day is typically used by DARPA to brief interested teams, explain goals and constraints, and encourage teaming and questions before proposals are submitted.
What was the proposal due date after the amendments?
The original closing date was July 9, 2012, and the amended (current) closing date became July 23, 2012.
When was the opportunity posted and when was it archived?
The opportunity was posted March 29, 2012, created in the system June 14, 2012, and later archived January 23, 2013.
Where should applicants look for the full details of the announcement?
For additional details, DARPA directed applicants to the MTO Solicitations page and the full DARPA BAA 12-16 attachment.
Who should be contacted for access issues or coordination questions?
The listed point of contact for access issues and coordination is Dr. Sanjay Raman, Program Manager at DARPA MTO and BAA Coordinator.
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