Opportunity Information: Apply for 12 556
Apply for 12 556
- The National Science Foundation in the science and technology and other research and development sector is offering a public funding opportunity titled "FAILURE RESISTANT SYSTEMS" and is now available to receive applicants.
- Interested and eligible applicants and submit their applications by referencing the CFDA number(s): 47.041 Engineering Grants 47.070 Computer and Information Science and Engineering.
- This funding opportunity was created on Apr 24, 2012 and posted on Apr 24, 2012.
- Applicants must submit their applications by Jul 26, 2012 Full Proposal Deadline(s) July 26, 2012. (Agency may still review applications by suitable applicants for the remaining/unused allocated funding in 2026.)
- The funding agency has allocated a total of $6,000,000.00 to eligible and selected applicants.
- Each selected applicant is eligible to receive up to $400,000.00 in funding.
- The number of recipients for this funding is limited to 20 candidate(s).
- Eligible applicants include: Others (see text field entitled Additional Information on Eligibility for clarification).
- Organization Limit Proposals may only be submitted by the following Universities and Colleges Universities and two and four year colleges (including community colleges) accredited in, and having a campus located in the US, acting on behalf of their faculty members. Such organizations also are referred to as academic institutions.
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Opportunity Summary:
The FAILURE RESISTANT SYSTEMS opportunity (NSF Publication 12-556) is a joint research program from the National Science Foundation (NSF) and the Semiconductor Research Corporation (SRC) focused on creating fundamentally new ways to design electronic circuits and computing systems that keep working correctly even when things go wrong. The central idea is that modern hardware is increasingly exposed to transient faults (temporary upsets), permanent faults (hard failures), and systematic failures (repeatable design- or process-related issues), and that the usual methods engineers rely on to guarantee reliability are becoming too costly or inefficient as chips continue to shrink and become more complex. The program frames reliability as a growing, industry-wide challenge that spans everything from large-scale information processing platforms used for communication and computation to small embedded systems used in medical devices and automotive electronics, where dependable operation is often safety-critical.
A key motivation behind the program is that advances in miniaturization and fabrication have created a real tension between efficiency and reliability. As integrated circuits scale down, the rates of faults, manufacturing variation, and performance degradation from aging effects rise, making it less realistic to assume that every device, circuit, or component will behave exactly as intended for its entire lifetime. On top of that, many systems are now built by integrating third-party IP blocks from different vendors, which can make real-world behavior harder to predict, especially under stress, temperature extremes, radiation, wear-out, or other adverse conditions. The solicitation emphasizes that, in deployed systems, engineers may not fully know how all pieces behave when pushed outside ideal assumptions, so designs need to anticipate uncertainty rather than treat failures as rare exceptions.
The opportunity argues that traditional reliability techniques will not scale well into future technology generations. Methods like conservative voltage and clock margins, replication, or disk-based checkpointing can work, but they often impose large power, performance, and cost penalties, and they tend to operate at only a single layer of the system. Because reliability emerges from interactions across the full stack (devices, circuits, architectures, systems software, and applications), single-layer approaches typically have to assume worst-case behavior everywhere else, which leads to overdesign and inefficiency. In contrast, this program prioritizes a cross-layer, system-level approach that distributes reliability responsibilities across multiple layers, including both digital and analog components. By using information available at each layer (and even application-level knowledge about what errors matter and which can be tolerated or corrected), researchers can potentially achieve high reliability with much lower overhead than today’s one-size-fits-all techniques.
The solicitation is therefore aimed at research that develops cross-layer methods to tolerate errors, variation, aging, and degradation in a more targeted and adaptable way. The vision is that different failure mechanisms should be handled at the most efficient layer of the stack, and that reliability strategies should adapt to changing hardware state, operating environments, and the needs of specific applications. The expected payoff is broad: foundational advances in failure-resilient design could improve competitiveness across multiple industries, reshape product categories, and speed the translation of academic results into practical technologies used in real systems.
From a funding and administrative standpoint, this is a discretionary grant program in the Science and Technology / R&D category. NSF anticipated making about 20 awards with an estimated total program funding of $6,000,000. Individual awards were expected to fall between $300,000 (floor) and $400,000 (ceiling). There was no cost sharing or matching requirement. The opportunity was posted on April 24, 2012, with full proposals due July 26, 2012, and it was archived August 26, 2012. The CFDA listings associated with the program were 47.041 (Engineering Grants) and 47.070 (Computer and Information Science and Engineering), reflecting that proposals could span both engineering and computing research themes.
Eligibility was limited to US academic institutions: accredited universities and colleges (including two- and four-year institutions and community colleges) with a campus located in the United States, submitting on behalf of their faculty members. The listed agency was the National Science Foundation, and the additional information link referenced NSF Publication 12-556. For access issues related to the announcement through Grants.gov, the notice directed applicants to NSF Grants.gov support at grantsgovsupport@nsf.gov.
Failure Resistant Systems (NSF Publication 12-556) - FAQs
What is the Failure Resistant Systems opportunity (NSF Publication 12-556)?
Failure Resistant Systems (NSF Publication 12-556) is a joint research program from the National Science Foundation (NSF) and the Semiconductor Research Corporation (SRC). It focuses on creating fundamentally new ways to design electronic circuits and computing systems that continue to operate correctly even when faults or failures occur.
What problem is this program trying to solve?
The program targets the growing reliability challenge in modern hardware. As chips shrink and systems become more complex, hardware is increasingly exposed to transient faults (temporary upsets), permanent faults (hard failures), and systematic failures (repeatable design- or process-related issues). Traditional approaches to reliability are becoming too costly or inefficient under these trends.
What kinds of failures does the solicitation emphasize?
The opportunity highlights three broad categories: transient faults, permanent faults, and systematic failures. It also emphasizes related real-world contributors such as manufacturing variation, aging-related degradation, and uncertainty in how integrated components behave under non-ideal conditions.
Why does reliability get harder as technology scales and systems integrate more components?
The solicitation explains that miniaturization and fabrication advances increase fault rates, variation, and degradation from aging effects. In addition, systems often integrate third-party IP blocks from different vendors, making behavior harder to predict under stress, temperature extremes, radiation, wear-out, or other adverse conditions. The program frames this as a need to anticipate uncertainty rather than assume failures are rare exceptions.
What is meant by a "cross-layer" approach in this program?
A cross-layer approach distributes reliability responsibilities across multiple layers of the computing stack rather than relying on a single layer. The solicitation explicitly references interactions spanning devices, circuits, architectures, systems software, and applications, and it notes that both digital and analog components are in scope.
Why does the program discourage relying only on traditional reliability techniques?
The opportunity argues that common techniques (such as conservative voltage and clock margins, replication, or disk-based checkpointing) can be effective but often impose large power, performance, and cost penalties. It also notes that when techniques operate at only one layer, they typically must assume worst-case behavior elsewhere, which can lead to overdesign and inefficiency.
What kinds of research directions is the solicitation aiming to support?
The solicitation is aimed at research that develops cross-layer, system-level methods to tolerate errors, variation, aging, and degradation in a targeted and adaptable way. The vision is that different failure mechanisms should be handled at the most efficient layer of the stack and that strategies should adapt to changing hardware state, operating environments, and the needs of specific applications.
Does the program focus only on large computing systems, or also on embedded systems?
Both. The solicitation frames reliability as an industry-wide challenge spanning large-scale information processing platforms used for communication and computation as well as small embedded systems used in medical devices and automotive electronics, where dependable operation can be safety-critical.
How does the solicitation view application-level knowledge in reliability design?
It emphasizes using information available at each layer, including application-level knowledge about what errors matter and which can be tolerated or corrected. This is presented as a way to achieve high reliability with lower overhead than one-size-fits-all methods.
What is the expected impact of successful research under this program?
The solicitation anticipates that foundational advances in failure-resilient design could improve competitiveness across multiple industries, reshape product categories, and accelerate translation of academic results into practical technologies used in real systems.
Which agencies or organizations are associated with this opportunity?
This is a joint research program from NSF and SRC, with NSF listed as the agency on the opportunity announcement. The additional information link referenced NSF Publication 12-556.
What is the grant category for this opportunity?
The opportunity is described as a discretionary grant program in the Science and Technology / R&D category.
How much total funding was anticipated for the program?
NSF anticipated an estimated total program funding amount of $6,000,000.
How many awards did NSF anticipate making?
NSF anticipated making about 20 awards.
What was the expected award size range?
Individual awards were expected to fall between $300,000 (floor) and $400,000 (ceiling).
Was cost sharing or matching required?
No. The opportunity stated there was no cost sharing or matching requirement.
When was the opportunity posted, and what were the proposal dates?
The opportunity was posted on April 24, 2012. Full proposals were due July 26, 2012. The opportunity was archived on August 26, 2012.
Which CFDA listings were associated with this program?
The CFDA listings associated with the program were 47.041 (Engineering Grants) and 47.070 (Computer and Information Science and Engineering). This reflects that proposals could span both engineering and computing research themes.
Who was eligible to apply?
Eligibility was limited to US academic institutions: accredited universities and colleges (including two- and four-year institutions and community colleges) with a campus located in the United States, applying on behalf of their faculty members.
Could non-academic organizations apply directly under the stated eligibility?
Based on the eligibility description provided, the solicitation limited eligibility to US academic institutions submitting on behalf of faculty members.
Where could applicants find the official solicitation reference?
The notice referenced NSF Publication 12-556 as the additional information link for the opportunity.
Who should applicants contact for Grants.gov access issues related to the announcement?
For access issues related to the announcement through Grants.gov, the notice directed applicants to NSF Grants.gov support at grantsgovsupport@nsf.gov.
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