Fracture Putty | Apply Online

Opportunity Summary:

The Fracture Putty opportunity (Funding Opportunity Number DARPA BAA 08-50) was a DARPA Defense Sciences Office research solicitation focused on creating an advanced, dynamic biomaterial for emergency and battlefield-style orthopedic trauma care. The core idea was to develop a moldable "putty" that could be packed directly into and around a compound fracture and rapidly restore mechanical stability. Unlike traditional approaches that rely on external fixation, internal plates, or long-curing cements, DARPA was looking for a material that could deliver full load-bearing capability within hours of placement, meaning it would quickly become strong enough to support weight and functional movement after severe bone injury.

Beyond immediate stabilization, the program emphasized biological compatibility and long-term healing support. The putty was expected to form an internal structure that is osteoconductive, essentially acting like a scaffold that encourages bone cells to grow through it and lay down new bone. In practical terms, this means the material would not just "fill space" but would provide a bone-like architecture that helps the body rebuild real bone across the damaged region. The solicitation also required that the putty degrade over time into harmless, resorbable byproducts, gradually disappearing as natural bone regeneration takes over. This feature would reduce or eliminate the need for later surgical removal and aim for a smoother transition from temporary synthetic support to fully healed biological tissue.

From an administrative and funding standpoint, the opportunity was categorized as discretionary science and technology research and development under CFDA 12.910 (Research and Technology Development). DARPA indicated multiple possible award instruments, including cooperative agreements, grants, other transactions/arrangements, and procurement contracts, reflecting the agency's typical flexibility in structuring R and D efforts depending on the proposer, technical risk, and desired level of government involvement. There was no cost sharing or matching requirement listed, which generally lowers the barrier for universities, small businesses, and nontraditional performers to participate.

Eligibility was described as unrestricted, meaning the competition was open to essentially any qualified entity (such as companies, startups, universities, nonprofits, federally funded research centers, and potentially individuals or teams, subject to any clarifications in the full BAA). Interested parties were directed to the attached Broad Agency Announcement for the complete technical requirements, proposal instructions, evaluation criteria, and any constraints related to safety, testing, intellectual property, regulatory considerations, or military relevance.

Key dates show that the opportunity was posted and created on August 13, 2008, with an original and final closing date of June 4, 2009, and an archive date of July 4, 2009. Questions about accessing the full announcement were routed to the listed point of contact, Mitchell Zakin, identified as the BAA Coordinator. Overall, the solicitation reflects DARPA's interest in a fast-acting, field-deployable orthopedic repair material that combines immediate mechanical performance with a biologically supportive, resorbable scaffold to improve outcomes after complex fractures.

Browse more opportunities from the same agency: DARPA Defense Sciences Office

Browse more opportunities from the same category: Science and Technology and other Research and Development

Next opportunity: California Least Tern Foraging Study in San Diego Bay and Near Ocean Waters

Previous opportunity: NWRS SPECIAL PROJECT SUPPORT DESERT BIGHORN SHEEP SAN ANDRES NWR

USGrants.org Applicant Portal:

Are you interested in learning about about how to apply for this government funding opportunity? You can create a free applicant account and receive instant access to our applicant portal that many business owners like you have benefited from.

Apply for DARPA BAA 08 50

 

[Watch] how do funding administrators access proposals?

Applicants also applied for:

Applicants who have applied for this opportunity (DARPA BAA 08 50) also looked into and applied for these:

 

Grant application guides and resources

It is always free to apply for government grants. However the process may be very complex depending on the funding opportunity you are applying for. Let us help you!

Apply for Grants

 

 

Premium leads for funding administrators, grant writers, and loan issuers

Thousands of people visit our website for their funding needs every day. When a user creates a grant proposal and files for submission, we pass the information on to funding administrators, grant writers, and government loan issuers.

If you manage government grant programs, provide grant writing services, or issue personal or government loans, we can help you reach your audience.

Subscribe to Leads

 

Request more information:

Would you like to learn more about this funding opportunity, similar opportunities to "DARPA BAA 08 50", eligibility, application service, and/or application tips? Submit an inquiry below:

Don't forget to subscribe to our grant alerts mailing list to receive weekly alerts on new and updated grant funding opportunities like this one in your email.