Opportunity Information: Apply for DARPA BAA 13 21
Apply for DARPA BAA 13 21
- The DARPA Microsystems Technology Office in the science and technology and other research and development sector is offering a public funding opportunity titled "ICECool Applications (ICECool Apps)" and is now available to receive applicants.
- Interested and eligible applicants and submit their applications by referencing the CFDA number(s): 12.910 Research and Technology Development.
- This funding opportunity was created on Feb 12, 2013 and posted on Feb 6, 2013.
- Applicants must submit their applications by Mar 22, 2013. (Agency may still review applications by suitable applicants for the remaining/unused allocated funding in 2026.)
- Eligible applicants include: Unrestricted (i.e., open to any type of entity above), subject to any clarification in text field entitled Additional Information on Eligibility.
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Opportunity Summary:
DARPA Microsystems Technology Office posted Broad Agency Announcement (BAA) DARPA-BAA-13-21 titled ICECool Applications (ICECool Apps) to fund research aimed at breaking the thermal bottlenecks that limit high-performance military electronics. The program sits in the science and technology R&D category (CFDA 12.910) and is intended to support disruptive cooling and heat-spreading approaches that can keep next-generation electronics operating within normal temperature limits, while also reducing size, weight, and power (SWaP). In practical terms, ICECool Apps targets the heat problem that shows up when you push RF power amplifiers and embedded computing hardware to higher power densities: performance rises, but localized hot spots and overall heat flux quickly become the limiting factor unless the thermal design changes dramatically.
The technical focus of ICECool Apps is chip-level heat removal at extremely high heat flux levels, described as kilowatt-class heat flux and heat density, with explicit attention to controlling very small, sub-millimeter hot spots (for example in high-power transistor regions). Rather than relying on conventional heat sinks and system-level cooling, the effort emphasizes cooling solutions integrated close to, within, or between chips. The BAA highlights approaches such as intra-chip and/or inter-chip microfluidic cooling, along with on-chip thermal interconnects, meaning engineered pathways that move heat efficiently out of hot regions into a cooling structure. The intent is to enable higher-performing RF power amplifiers and embedded computing systems by removing heat where it is generated, fast enough and locally enough that devices can operate in their commonly accepted temperature range even under aggressive electrical loading.
Administratively, the notice referenced an Amendment 01 that updated the solicitation. That amendment had three main purposes: first, it revised or corrected the HEMT (high electron mobility transistor) hot-spot flux metric used throughout the BAA, especially in Table 1 and Table 2, which matters because those tables typically define performance targets, evaluation metrics, or phase goals. Second, it made general administrative and wording revisions. Third, it removed the original Attachment 1 and replaced it with a new Attachment 1 identified as a Cost Proposal Checklist, clarifying what proposers must include in their cost submission. The amendment notes that changes were highlighted in yellow in the conformed DARPA-BAA-13-21 document, and proposers were expected to rely on that updated version for accurate metrics and required attachments.
From a funding and eligibility standpoint, ICECool Apps was listed as a discretionary opportunity and allowed multiple award instruments, including cooperative agreements, grants, other transactions/procurement contracts, depending on what DARPA determined appropriate for a given effort. Eligibility was described as unrestricted (open broadly to different entity types), subject to any additional constraints contained in the full text of the announcement. The opportunity did not require cost sharing or matching. Standard listing fields showed no explicit award floor or ceiling (both recorded as 0), which usually means the solicitation itself, rather than the synopsis, contains the details on anticipated funding levels, number of awards, or project scale.
Key dates in the posting show it was originally posted February 6, 2013, created in the system February 12, 2013, with an original and current closing date of March 22, 2013, and an archive date of September 23, 2013. The point of contact listed for access issues was Dr. Avram Bar-Cohen, the DARPA/MTO program manager associated with the BAA, and the solicitation could be found via the MTO Solicitations page. Overall, ICECool Apps can be read as a push to move cooling technology into the chip and package itself, so that future RF and computing hardware can run harder without being throttled by hot spots, bulky thermal hardware, or SWaP penalties.
Frequently Asked Questions (FAQs) - DARPA ICECool Applications (DARPA-BAA-13-21)
What is the ICECool Applications (ICECool Apps) opportunity?
ICECool Applications (ICECool Apps) is a DARPA Microsystems Technology Office (MTO) Broad Agency Announcement (BAA) opportunity, identified as DARPA-BAA-13-21. It funds research aimed at breaking thermal bottlenecks that limit high-performance military electronics.
Which DARPA office is sponsoring this BAA?
The opportunity was posted by DARPA's Microsystems Technology Office (MTO).
What is the main goal of the ICECool Apps program?
The program is intended to support disruptive cooling and heat-spreading approaches that keep next-generation electronics within normal operating temperature limits while also reducing size, weight, and power (SWaP) impacts associated with thermal management.
What problem is ICECool Apps trying to solve in practical terms?
ICECool Apps targets the thermal limits that appear when RF power amplifiers and embedded computing hardware are pushed to higher power densities. As electrical performance increases, localized hot spots and overall heat flux can become the limiting factor unless the thermal design changes dramatically.
What kind of research category does this opportunity fall under?
The opportunity sits in the science and technology R&D category and is listed under CFDA 12.910.
What is the technical focus of ICECool Apps?
The technical focus is chip-level heat removal at extremely high heat flux levels, described as kilowatt-class heat flux and heat density, with explicit attention to controlling very small, sub-millimeter hot spots (such as those that occur in high-power transistor regions).
What types of hot spots are specifically mentioned?
The notice specifically highlights sub-millimeter hot spots, for example in high-power transistor regions, and references HEMT (high electron mobility transistor) hot-spot flux metrics used throughout the BAA.
Does ICECool Apps focus on conventional heat sinks and system-level cooling?
No. Rather than relying on conventional heat sinks and system-level cooling, ICECool Apps emphasizes cooling solutions integrated close to, within, or between chips so heat is removed where it is generated.
What approaches are highlighted as examples of the kinds of solutions DARPA is interested in?
The BAA highlights approaches such as intra-chip and/or inter-chip microfluidic cooling, along with on-chip thermal interconnects (engineered pathways that move heat efficiently out of hot regions into a cooling structure).
What are "on-chip thermal interconnects" in the context of this BAA?
On-chip thermal interconnects are described as engineered pathways intended to move heat efficiently out of hot regions into a cooling structure, enabling more effective local heat removal than conventional system-level approaches.
What performance benefit is DARPA trying to enable with ICECool Apps?
The intent is to enable higher-performing RF power amplifiers and embedded computing systems by removing heat locally and quickly enough that devices can operate in their commonly accepted temperature range even under aggressive electrical loading.
Was there an amendment to the solicitation?
Yes. The notice referenced Amendment 01, which updated the solicitation.
What did Amendment 01 change?
Amendment 01 had three main purposes: (1) revising or correcting the HEMT hot-spot flux metric used throughout the BAA, especially in Table 1 and Table 2; (2) making general administrative and wording revisions; and (3) removing the original Attachment 1 and replacing it with a new Attachment 1 identified as a Cost Proposal Checklist.
Why does the HEMT hot-spot flux metric correction matter?
The amendment notes that the HEMT hot-spot flux metric was revised or corrected throughout the BAA, especially in Table 1 and Table 2, which typically define performance targets, evaluation metrics, or phase goals. Proposers were expected to use the updated version for accurate metrics.
What happened to Attachment 1?
The original Attachment 1 was removed and replaced with a new Attachment 1 identified as a Cost Proposal Checklist, clarifying what proposers must include in their cost submission.
How were amendment changes indicated in the updated document?
The amendment states that changes were highlighted in yellow in the conformed DARPA-BAA-13-21 document.
Which version of the BAA were proposers expected to rely on?
Proposers were expected to rely on the conformed, updated DARPA-BAA-13-21 document (as updated by Amendment 01) for accurate metrics and required attachments.
What type of funding opportunity is this listed as?
ICECool Apps was listed as a discretionary opportunity.
What award instruments could be used under this BAA?
The opportunity allowed multiple award instruments, including cooperative agreements, grants, and other transactions/procurement contracts, depending on what DARPA determined appropriate for a given effort.
Who is eligible to apply?
Eligibility was described as unrestricted (open broadly to different entity types), subject to any additional constraints contained in the full text of the announcement.
Is cost sharing or matching required?
No. The opportunity did not require cost sharing or matching.
Are there stated minimum or maximum award amounts in the listing fields?
The standard listing fields showed no explicit award floor or ceiling (both recorded as 0). This generally indicates that anticipated funding levels, number of awards, or project scale details would be contained in the full solicitation rather than the synopsis.
When was the opportunity posted and when did it close?
Key dates show it was originally posted on February 6, 2013, created in the system on February 12, 2013, and had an original and current closing date of March 22, 2013.
When was the opportunity archived?
The archive date listed was September 23, 2013.
Who was the point of contact listed in the notice?
The point of contact listed for access issues was Dr. Avram Bar-Cohen, the DARPA/MTO program manager associated with the BAA.
Where could the solicitation be found?
The notice indicates the solicitation could be found via the MTO Solicitations page.
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