Intrachip/Interchip Enhanced Cooling Fundamentals (ICECool Fundamentals) | Apply Online

Opportunity Summary:

DARPA Microsystems Technology Office (MTO) issued Broad Agency Announcement (BAA) DARPA BAA 12-50 for a research effort titled Intrachip/Interchip Enhanced Cooling Fundamentals (ICECool Fundamentals). This opportunity is positioned as the opening technical thrust of DARPA's broader ICECool program, focused on creating the core scientific and engineering building blocks needed to enable evaporative microfluidic cooling directly within chips (intrachip) and between chips (interchip), including tightly integrated 3D chip stacks where heat removal is especially difficult.

The central aim is to advance evaporative cooling approaches that use micro-scale fluid channels and phase change (evaporation/boiling) to remove very high heat fluxes from advanced semiconductor devices. The solicitation emphasizes two tightly linked research directions: first, developing and demonstrating microfabrication methods that allow evaporative microfluidic structures to be integrated into semiconductor wafers that contain multiple microchannels; and second, studying the thermofluidic behavior of evaporative flows in these tiny channel networks. In practical terms, DARPA is looking for teams to build the capability to fabricate these complex microchannel structures in semiconductor materials and then to characterize, model, and validate how two-phase evaporative flow behaves in closed-loop or recirculating microchannel systems, either within a single die or in the narrow microgaps between dies in a 3D stack. A key theme is correlation: experiments, physics-based models, and predictive tools should line up so the community can reliably design next-generation chip cooling architectures rather than relying on one-off demonstrations.

Amendment 01 to the announcement made two main changes. It revised the full proposal due date and introduced technical edits to the BAA document, with those edits indicated in yellow in the attached conformed version of DARPA BAA 12-50. The original closing date of August 30, 2012 was updated to a current closing date of September 13, 2012, reflecting the amended schedule. The opportunity was originally posted on June 7, 2012, with a creation date of July 19, 2012, and an archive date of March 14, 2013.

From an administrative and funding standpoint, this is a discretionary science and technology research and development opportunity. DARPA indicated multiple potential award instruments under the BAA, including cooperative agreements, grants, other transactions, and procurement contracts, giving the agency flexibility to select the mechanism best matched to the technical and programmatic risk. The CFDA number listed is 12.910 (Research and Technology Development). The posting states there is no cost sharing or matching requirement. Award ceiling and floor are listed as 0 in the summary fields, which typically means the funding range was not specified in the synopsis and applicants would need to consult the full BAA for budget expectations, limits, and the number or size of anticipated awards.

Eligibility is described as unrestricted, meaning proposals could be submitted by any type of entity as allowed by the BAA terms, subject to any clarifications in the full text under eligibility. That generally implies participation could include universities, companies (including small businesses), nonprofit research organizations, and potentially federally funded research and development centers, assuming compliance with DARPA requirements and any teaming, security, or export control constraints that might be spelled out in the full announcement.

For access and submission details, DARPA referenced the MTO Solicitations page as the additional information link. The point of contact for assistance accessing the full announcement was Dr. Avram Bar-Cohen, listed as Program Manager, with an MTO BAA Coordinator also referenced. The attached DARPA BAA 12-50 document is the authoritative source for the technical areas, deliverables, evaluation criteria, and submission instructions that applicants would need to follow.

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